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| www..com MC34167, MC33167 5.0 A, Step-Up/Down/ Inverting Switching Regulators The MC34167, MC33167 series are high performance fixed frequency power switching regulators that contain the primary functions required for dc-to-dc converters. This series was specifically designed to be incorporated in step-down and voltage-inverting configurations with a minimum number of external components and can also be used cost effectively in step-up applications. These devices consist of an internal temperature compensated reference, fixed frequency oscillator with on-chip timing components, latching pulse width modulator for single pulse metering, high gain error amplifier, and a high current output switch. Protective features consist of cycle-by-cycle current limiting, undervoltage lockout, and thermal shutdown. Also included is a low power standby mode that reduces power supply current to 36 mA. Features http://onsemi.com MARKING DIAGRAMS TO-220 TH SUFFIX CASE 314A 1 5 MC 3x167T AWLYWWG Heatsink surface connected to Pin 3 * * * * * * * * * * * * * * Output Switch Current in Excess of 5.0 A Fixed Frequency Oscillator (72 kHz) with On-Chip Timing Provides 5.05 V Output without External Resistor Divider Precision 2% Reference 0% to 95% Output Duty Cycle Cycle-by-Cycle Current Limiting Undervoltage Lockout with Hysteresis Internal Thermal Shutdown Operation from 7.5 V to 40 V Standby Mode Reduces Power Supply Current to 36 mA Economical 5-Lead TO-220 Package with Two Optional Leadforms Also Available in Surface Mount D2PAK Package Moisture Sensitivity Level (MSL) Equals 1 Pb-Free Packages are Available Vin ILIMIT Oscillator 4 1 5 TO-220 TV SUFFIX CASE 314B MC 3x167T AWLYWWG 1 5 Pin 1. 2. 3. 4. 5. TO-220 T SUFFIX CASE 314D MC 3x167T AWLYWWG S Q R 2 1 UVLO Voltage Feedback Input Switch Output Ground Input Voltage/VCC Compensation/Standby D2PAK D2T SUFFIX CASE 936A PWM MC 3x167T AWLYWWG 5 L Heatsink surface (shown as terminal 6 in case outline 1 drawing) is connected to Pin 3 x A WL Y WW G = 3 or 4 = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package 5 Thermal Reference EA 1 VO 5.05 V/ 5.0 A 3 5 This device contains 143 active transistors. Figure 1. Simplified Block Diagram (Step Down Application) (c) Semiconductor Components Industries, LLC, 2005 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 17 of this data sheet. 1 November, 2005 - Rev. 7 Publication Order Number: MC34167/D MC34167, MC33167 MAXIMUM RATINGS (Note 1 and 2) Rating Power Supply Input Voltage Switch Output Voltage Range Voltage Feedback and Compensation Input Voltage Range Power Dissipation Case 314A, 314B and 314D (TA = +25C) Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Case 936A (D2PAK) (TA = +25C) Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Operating Junction Temperature Operating Ambient Temperature (Note 3) MC34167 MC33167 Storage Temperature Range Symbol VCC VO(switch) VFB, VComp PD qJA qJC PD qJA qJC TJ TA 0 to + 70 - 40 to + 85 Tstg - 65 to +150 C Value 40 -2.0 to + Vin -1.0 to + 7.0 Internally Limited 65 5.0 Internally Limited 70 5.0 +150 Unit V V V W C/W C/W W C/W C/W C C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Maximum package power dissipation limits must be observed to prevent thermal shutdown activation. 2. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL-STD-883, Method 3015. Machine Model Method 200 V. 3. Tlow = 0C for MC34167 Thigh = + 70C for MC34167 = - 40C for MC33167 = + 85C for MC33167 http://onsemi.com 2 MC34167, MC33167 ELECTRICAL CHARACTERISTICS (VCC = 12 V, for typical values TA = +25C, for min/max values TA is the operating ambient temperature range that applies (Notes 4, 5), unless otherwise noted.) Characteristic OSCILLATOR Frequency (VCC = 7.5 V to 40 V) ERROR AMPLIFIER Voltage Feedback Input Threshold TA =+ 25C TA = Tlow to Thigh VFB(th) Regline IIB PSRR VOH VOL 4.95 4.85 - - 60 4.2 - 5.05 - 0.03 0.15 80 4.9 1.6 5.15 5.20 0.078 1.0 - - 1.9 V %/V mA dB V TA = +25C TA = Tlow to Thigh fOSC 65 62 72 - 79 81 kHz Symbol Min Typ Max Unit Line Regulation (VCC = 7.5 V to 40 V, TA = +25C) Input Bias Current (VFB = VFB(th) + 0.15 V) Power Supply Rejection Ratio (VCC = 10 V to 20 V, f = 120 Hz) Output Voltage Swing PWM COMPARATOR Duty Cycle (VCC = 20 V) SWITCH OUTPUT Output Voltage Source Saturation (VCC = 7.5 V, ISource = 5.0 A) Off-State Leakage (VCC = 40 V, Pin 2 = GND) Current Limit Threshold (VCC = 7.5 V) Switching Times (VCC = 40 V, Ipk = 5.0 A, L = 225 mH, TA = +25C) Output Voltage Rise Time Output Voltage Fall Time UNDERVOLTAGE LOCKOUT Startup Threshold (VCC Increasing, TA = +25C) Hysteresis (VCC Decreasing, TA = +25C) TOTAL DEVICE Power Supply Current (TA = +25C ) Standby (VCC = 12 V, VComp < 0.15 V) Operating (VCC = 40 V, Pin 1 = GND for maximum duty cycle) Maximum (VFB = 0 V) Minimum (VComp = 1.9 V) High State (ISource = 75 mA, VFB = 4.5 V) Low State (ISink = 0.4 mA, VFB = 5.5 V) DC(max) DC(min) 92 0 95 0 100 0 % Vsat Isw(off) Ipk(switch) tr tf Vth(UVLO) VH(UVLO) ICC - - 5.5 - - (VCC -1.5) 0 6.5 100 50 (VCC -1.8) 100 8.0 200 100 V mA A ns 5.5 0.6 5.9 0.9 6.3 1.2 V V - - 36 40 100 60 mA mA 4. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 5. Tlow = 0C for MC34167 Thigh = + 70C for MC34167 = - 40C for MC33167 = + 85C for MC33167 http://onsemi.com 3 MC34167, MC33167 V FB(th), VOLTAGE FEEDBACK INPUT THRESHOLD (V) 5.25 VCC = 12 V 5.17 5.09 5.01 VFB(th) Min = 4.95 V 4.93 4.85 - 55 VFB(th) Max = 5.15 V 100 I IB, INPUT BIAS CURRENT (nA) 80 60 40 20 0 - 55 VCC = 12 V VFB = VFB(th) VFB(th) Typ = 5.05 V - 25 0 25 50 75 TA, AMBIENT TEMPERATURE (C) 100 125 - 25 0 25 50 75 TA, AMBIENT TEMPERATURE (C) 100 125 Figure 2. Voltage Feedback Input Threshold versus Temperature Figure 3. Voltage Feedback Input Bias Current versus Temperature A VOL , OPEN LOOP VOLTAGE GAIN (dB) 80 Gain 60 40 30 60 90 , EXCESS PHASE (DEGREES) VCC = 12 V VComp = 3.25 V RL = 100 k TA = +25C 0 Vsat , OUTPUT SATURATION VOLTAGE (V) 100 2.0 1.6 1.2 0.8 0.4 0 VCC = 12 V VFB = 5.5 V TA = +25C Phase 20 0 120 150 180 10 M - 20 10 100 1.0 k 10 k 100 k f, FREQUENCY (Hz) 1.0 M 0 0.4 0.8 1.2 1.6 ISink, OUTPUT SINK CURRENT (mA) 2.0 Figure 4. Error Amp Open Loop Gain and Phase versus Frequency Figure 5. Error Amp Output Saturation versus Sink Current f OSC, OSCILLATOR FREQUENCY CHANGE (%) DC, SWITCH OUTPUT DUTY CYCLE (%) 4.0 VCC = 12 V 100 80 60 40 20 0 1.5 VCC = 12 V TA = +25C 0 - 4.0 - 8.0 - 12 - 55 - 25 0 25 50 75 100 TA, AMBIENT TEMPERATURE (C) 125 2.0 2.5 3.0 3.5 4.0 VComp, COMPENSATION VOLTAGE (V) 4.5 Figure 6. Oscillator Frequency Change versus Temperature Figure 7. Switch Output Duty Cycle versus Compensation Voltage http://onsemi.com 4 MC34167, MC33167 Vsat, SWITCH OUTPUT SOURCE SATURATION (V) 0 - 0.5 -1.0 -1.5 - 2.0 - 2.5 - 3.0 0 2.0 4.0 6.0 ISource, SWITCH OUTPUT SOURCE CURRENT (A) 8.0 Vsw, SWITCH OUTPUT VOLTAGE (V) VCC TA = +25C 0 GND - 0.2 - 0.4 - 0.6 - 0.8 -1.0 -1.2 - 55 - 25 0 25 50 75 TA, AMBIENT TEMPERATURE (C) 100 125 Isw = 10 mA VCC = 12 V Pin 5 = 2.0 V Pins 1, 3 = GND Pin 2 Driven Negative Isw = 100 mA Figure 8. Switch Output Source Saturation versus Source Current Figure 9. Negative Switch Output Voltage versus Temperature I pk(switch), CURRENT LIMIT THRESHOLD (A) 7.2 I CC , SUPPLY CURRENT ( A) VCC = 12 V Pins 1, 2, 3 = GND 6.8 160 Pin 4 = VCC Pins 1, 3, 5 = GND Pin 2 Open TA = +25C 120 6.4 80 6.0 40 5.6 - 55 - 25 0 25 50 75 TA, AMBIENT TEMPERATURE (C) 100 125 0 0 10 20 30 VCC, SUPPLY VOLTAGE (V) 40 Figure 10. Switch Output Current Limit Threshold versus Temperature Figure 11. Standby Supply Current versus Supply Voltage V th(UVLO) , UNDERVOLTAGE LOCKOUT THRESHOLD (V) 6.5 I CC, SUPPLY CURRENT (mA) 6.0 5.5 5.0 4.5 4.0 - 55 Turn-Off Threshold VCC Decreasing Startup Threshold VCC Increasing 50 40 30 20 10 0 Pin 4 = VCC Pins 1, 3 = GND Pins 2, 5 Open TA = +25C 0 10 20 30 VCC, SUPPLY VOLTAGE (V) 40 - 25 0 25 50 75 TA, AMBIENT TEMPERATURE (C) 100 125 Figure 12. Undervoltage Lockout Thresholds versus Temperature Figure 13. Operating Supply Current versus Supply Voltage http://onsemi.com 5 MC34167, MC33167 Vin + Oscillator CT Current Sense 4 Input Voltage/V CC Cin S Q R Pulse Width Modulator PWM Latch Undervoltage Lockout Switch Output 2 Thermal Shutdown + 100 mA 5.05 V Reference Error Amp + Voltage Feedback Input 1 R2 L VO CO 120 GND 3 Compensation 5 CF RF = Sink Only Positive True Logic R1 Figure 14. MC34167 Representative Block Diagram 4.1 V Timing Capacitor CT Compensation 2.3 V ON Switch Output OFF Figure 15. Timing Diagram http://onsemi.com 6 MC34167, MC33167 INTRODUCTION The MC34167, MC33167 series are monolithic power switching regulators that are optimized for dc-to-dc converter applications. These devices operate as fixed frequency, voltage mode regulators containing all the active functions required to directly implement step-down and voltage-inverting converters with a minimum number of external components. They can also be used cost effectively in step-up converter applications. Potential markets include automotive, computer, industrial, and cost sensitive consumer products. A description of each section of the device is given below with the representative block diagram shown in Figure 14. Oscillator Figure 10 illustrates switch output current limit threshold versus temperature. Error Amplifier and Reference The oscillator frequency is internally programmed to 72 kHz by capacitor CT and a trimmed current source. The charge to discharge ratio is controlled to yield a 95% maximum duty cycle at the Switch Output. During the discharge of CT, the oscillator generates an internal blanking pulse that holds the inverting input of the AND gate high, disabling the output switch transistor. The nominal oscillator peak and valley thresholds are 4.1 V and 2.3 V respectively. Pulse Width Modulator A high gain Error Amplifier is provided with access to the inverting input and output. This amplifier features a typical dc voltage gain of 80 dB, and a unity gain bandwidth of 600 kHz with 70 degrees of phase margin (Figure 4). The noninverting input is biased to the internal 5.05 V reference and is not pinned out. The reference has an accuracy of 2.0% at room temperature. To provide 5.0 V at the load, the reference is programmed 50 mV above 5.0 V to compensate for a 1.0% voltage drop in the cable and connector from the converter output. If the converter design requires an output voltage greater than 5.05 V, resistor R1 must be added to form a divider network at the feedback input as shown in Figures 14 and 19. The equation for determining the output voltage with the divider network is: R Vout + 5.05 2 ) 1 R1 The Pulse Width Modulator consists of a comparator with the oscillator ramp voltage applied to the noninverting input, while the error amplifier output is applied into the inverting input. Output switch conduction is initiated when CT is discharged to the oscillator valley voltage. As CT charges to a voltage that exceeds the error amplifier output, the latch resets, terminating output transistor conduction for the duration of the oscillator ramp-up period. This PWM/Latch combination prevents multiple output pulses during a given oscillator clock cycle. Figures 7 and 15 illustrate the switch output duty cycle versus the compensation voltage. Current Sense The MC34167 series utilizes cycle-by-cycle current limiting as a means of protecting the output switch transistor from overstress. Each on cycle is treated as a separate situation. Current limiting is implemented by monitoring the output switch transistor current buildup during conduction, and upon sensing an overcurrent condition, immediately turning off the switch for the duration of the oscillator ramp-up period. The collector current is converted to a voltage by an internal trimmed resistor and compared against a reference by the Current Sense comparator. When the current limit threshold is reached, the comparator resets the PWM latch. The current limit threshold is typically set at 6.5 A. External loop compensation is required for converter stability. A simple low-pass filter is formed by connecting a resistor (R2) from the regulated output to the inverting input, and a series resistor-capacitor (RF, CF) between Pins 1 and 5. The compensation network component values shown in each of the applications circuits were selected to provide stability over the tested operating conditions. The step-down converter (Figure 19) is the easiest to compensate for stability. The step-up (Figure 21) and voltage-inverting (Figure 23) configurations operate as continuous conduction flyback converters, and are more difficult to compensate. The simplest way to optimize the compensation network is to observe the response of the output voltage to a step load change, while adjusting RF and CF for critical damping. The final circuit should be verified for stability under four boundary conditions. These conditions are minimum and maximum input voltages, with minimum and maximum loads. By clamping the voltage on the error amplifier output (Pin 5) to less than 150 mV, the internal circuitry will be placed into a low power standby mode, reducing the power supply current to 36 mA with a 12 V supply voltage. Figure 11 illustrates the standby supply current versus supply voltage. The Error Amplifier output has a 100 mA current source pull-up that can be used to implement soft-start. Figure 18 shows the current source charging capacitor CSS through a series diode. The diode disconnects CSS from the feedback loop when the 1.0 M resistor charges it above the operating range of Pin 5. http://onsemi.com 7 MC34167, MC33167 Switch Output The output transistor is designed to switch a maximum of 40 V, with a minimum peak collector current of 5.5 A. When configured for step-down or voltage-inverting applications, as in Figures 19 and 23, the inductor will forward bias the output rectifier when the switch turns off. Rectifiers with a high forward voltage drop or long turn on delay time should not be used. If the emitter is allowed to go sufficiently negative, collector current will flow, causing additional device heating and reduced conversion efficiency. Figure 9 shows that by clamping the emitter to 0.5 V, the collector current will be in the range of 100 mA over temperature. A 1N5825 or equivalent Schottky barrier rectifier is recommended to fulfill these requirements. Undervoltage Lockout functional before the output stage is enabled. The internal reference voltage is monitored by the comparator which enables the output stage when VCC exceeds 5.9 V. To prevent erratic output switching as the threshold is crossed, 0.9 V of hysteresis is provided. Thermal Protection An Undervoltage Lockout comparator has been incorporated to guarantee that the integrated circuit is fully Internal Thermal Shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 170C, the latch is forced into a `reset' state, disabling the output switch. This feature is provided to prevent catastrophic failures from accidental device overheating. It is not intended to be used as a substitute for proper heatsinking. The MC34167 is contained in a 5-lead TO-220 type package. The tab of the package is common with the center pin (Pin 3) and is normally connected to ground. DESIGN CONSIDERATIONS Do not attempt to construct a converter on wire-wrap or plug-in prototype boards. Special care should be taken to separate ground paths from signal currents and ground paths from load currents. All high current loops should be kept as short as possible using heavy copper runs to minimize ringing and radiated EMI. For best operation, a tight component layout is recommended. Capacitors Cin, CO, and all feedback components should be placed as close to the IC as physically possible. It is also imperative that the Schottky diode connected to the Switch Output be located as close to the IC as possible. http://onsemi.com 8 MC34167, MC33167 + 100 mA + 100 mA Error Amp 1 Compensation 120 5 R1 5 R1 I = Standby Mode VShutdown = VZener + 0.7 1 Error Amp 120 Compensation Figure 16. Low Power Standby Circuit Figure 17. Over Voltage Shutdown Circuit + 100 mA Error Amp 1 120 Compensation D2 Vin 1.0 M Css 5 D1 R1 tSoft-Start 35,000 Css Figure 18. Soft-Start Circuit http://onsemi.com 9 MC34167, MC33167 Vin 12 V + Oscillator ILIMIT 4 + S Q R PWM UVLO Q1 2 D1 1N5825 Cin 330 Thermal Reference + EA R2 1 6.8 k CO 4700 + + L 190 mH VO 5.05 V/5.0 A 3 5 CF 0.1 RF 68 k R1 Test Line Regulation Load Regulation Output Ripple Short Circuit Current Efficiency Conditions Vin = 10 V to 36 V, IO = 5.0 A Vin = 12 V, IO = 0.25 A to 5.0 A Vin = 12 V, IO = 5.0 A Vin = 12 V, RL = 0.1 W Vin = 12 V, IO = 5.0 A Vin = 24 V, IO = 5.0 A Results 4.0 mV = 0.039% 1.0 mV = 0.01% 20 mVpp 6.5 A 78.9% 82.6% L = Coilcraft M1496-A or General Magnetics Technology GMT-0223, 42 turns of #16 AWG on Magnetics Inc. 58350-A2 core. Heatsink = AAVID Engineering Inc. 5903B, or 5930B. The Step-Down Converter application is shown in Figure 19. The output switch transistor Q1 interrupts the input voltage, generating a squarewave at the LCO filter input. The filter averages the squarewaves, producing a dc output voltage that can be set to any level between Vin and Vref by controlling the percent conduction time of Q1 to that of the total oscillator cycle time. If the converter design requires an output voltage greater than 5.05 V, resistor R1 must be added to form a divider network at the feedback input. Figure 19. Step-Down Converter 3.0 MC34167 STEP-DOWN + (Bottom View) Figure 20. Step-Down Converter Printed Circuit Board and Component Layout http://onsemi.com 10 EEEEE EEE EEEEE EEE EEEEE EEEEE EEEEE EEEEE R2 RF CF R1 (Top View) + 1.9 Vin - CO - VO + + L D1 Cin MC34167, MC33167 Vin 12 V + Oscillator ILIMIT 4 + S Q R PWM UVLO *RG 620 Q2 MTP3055EL + EA R2 1 6.8 k CO 2200 D3 1N967A D2 1N5822 + VO 28 V/0.9 A Q1 2 D1 1N5825 L 190 mH D4 1N4148 Reference + Cin 330 Thermal 3 5 CF 0.47 RF 4.7 k R1 1.5 k *Gate resistor RG, zener diode D3, and diode D4 are required only when Vin is greater than 20 V. Test Line Regulation Load Regulation Output Ripple Short Circuit Current Efficiency Conditions Vin = 10 V to 24 V, IO = 0.9 A Vin = 12 V, IO = 0.1 A to 0.9 A Vin = 12 V, IO = 0.9 A Vin = 12 V, RL = 0.1 W Vin = 12 V, IO = 0.9 A Vin = 24 V, IO = 0.9 A Results 10 mV = 0.017% 30 mV = 0.053% 140 mVpp 6.0 A 80.1% 87.8% L = Coilcraft M1496-A or General Magnetics Technology GMT-0223, 42 turns of #16 AWG on Magnetics Inc. 58350-A2 core. Heatsink = AAVID Engineering Inc. MC34167: 5903B, or 5930B MTP3055EL: 5925B Figure 21 shows that the MC34167 can be configured as a step-up/down converter with the addition of an external power MOSFET. Energy is stored in the inductor during the ON time of transistors Q1 and Q2. During the OFF time, the energy is transferred, with respect to ground, to the output filter capacitor and load. This circuit configuration has two significant advantages over the basic step-up converter circuit. The first advantage is that output short circuit protection is provided by the MC34167, since Q1 is directly in series with Vin and the load. Second, the output voltage can be programmed to be less than Vin. Notice that during the OFF time, the inductor forward biases diodes D1 and D2, transferring its energy with respect to ground rather than with respect to Vin. When operating with Vin greater than 20 V, a gate protection network is required for the MOSFET. The network consists of components RG, D3, and D4. Figure 21. Step-Up/Down Converter 3.45 MC34167 STEP UP-DOWN D3 Vin - - + R2 CO VO 1.9 Cin R1 D1 RF L CF + (Bottom View) RG (Top View) Figure 22. Step-Up/Down Converter Printed Circuit Board and Component Layout http://onsemi.com 11 Q2 + + I II I II I II I I D2 IIIII III IIIII III IIIII IIIII IIIII IIIII MC34167, MC33167 Vin 12 V + ILIMIT Oscillator 4 + S Q R PWM UVLO Q1 2 L 190 mH D1 1N5825 Reference + EA R1 + 1 2.4 k VO -12 V/1.7 A CO 4700 + Cin 330 Thermal 3 5 CF 0.47 RF 4.7 k R2 3.3 k C1 0.047 Test Line Regulation Load Regulation Output Ripple Short Circuit Current Efficiency Conditions Vin = 10 V to 24 V, IO = 1.7 A Vin = 12 V, IO = 0.1 A to 1.7 A Vin = 12 V, IO = 1.7 A Vin = 12 V, RL = 0.1 W Vin = 12 V, IO = 1.7 A Vin = 24 V, IO = 1.7 A Results 15 mV = 0.61% 4.0 mV = 0.020% 78 mVpp 5.7 A 79.5% 86.2% L = Coilcraft M1496-A or General Magnetics Technology GMT-0223, 42 turns of #16 AWG on Magnetics Inc. 58350-A2 core. Heatsink = AAVID Engineering Inc. 5903B, or 5930B. Two potential problems arise when designing the standard voltage-inverting converter with the MC34167. First, the Switch Output emitter is limited to -1.5 V with respect to the ground pin and second, the Error Amplifier's noninverting input is internally committed to the reference and is not pinned out. Both of these problems are resolved by connecting the IC ground pin to the converter's negative output as shown in Figure 23. This keeps the emitter of Q1 positive with respect to the ground pin and has the effect of reversing the Error Amplifier inputs. Note that the voltage drop across R1 is equal to 5.05 V when the output is in regulation. Figure 23. Voltage-Inverting Converter 3.0 + + + MC34167 VOLTAGE-INVERTING Vin - - + R1 C1 + + (Bottom View) Figure 24. Voltage-Inverting Converter Printed Circuit Board and Component Layout http://onsemi.com 12 IIIIII IIII IIIIII IIIII IIIIII IIIIII IIIIII R2 RF CF (Top View) + 1.9 CO VO Cin D1 L + MC34167, MC33167 Vin 24 V + Oscillator ILIMIT 4 + S Q R PWM UVLO 2 1N5825 MUR110 + Thermal Reference + EA 6.8 k 1 1000 + VO1 5.0 V/3.0 A + T1 MUR110 VO3 1000 -12 V/200 mA 1000 VO2 + 1000 12 V/250 mA 3 5 0.1 68 k Figure 25. Triple Output Converter Tests Line Regulation 5.0 V 12 V -12 V 5.0 V 12 V -12 V 5.0 V 12 V -12 V 5.0 V 12 V -12 V TOTAL Conditions Vin = 15 V to 30 V, IO1 = 3.0 A, IO2 = 250 mA, IO3 = 200 mA Results 3.0 mV = 0.029% 572 mV = 2.4% 711 mV = 2.9% 1.0 mV = 0.009% 409 mV = 1.5% 528 mV = 2.0% 75 mVpp 20 mVpp 20 mVpp 6.5 A 2.7 A 2.2 A 84.2% Load Regulation Vin = 24 V, IO1 = 30 mA to 3.0 A, IO2 = 250 mA, IO3 = 200 mA Vin = 24 V, IO1 = 3.0 A, IO2 = 100 mA to 250 mA, IO3 = 200 mA Vin = 24 V, IO1 = 3.0 A, IO2 = 250 mA, IO3 = 75 mA to 200 mA Vin = 24 V, IO1 = 3.0 A, IO2 = 250 mA, IO3 = 200 mA Output Ripple Short Circuit Current Vin = 24 V, RL = 0.1 W Efficiency Vin = 24 V, IO1 = 3.0 A, IO2 = 250 mA, IO3 = 200 mA T1 = Primary: Coilcraft M1496-A or General Magnetics Technology GMT-0223, 42 turns of #16 AWG on Magnetics Inc. 58350-A2 core. T1 = Secondary: VO2 - 69 turns of #26 AWG T1 = Secondary: VO3 - 104 turns of #28 AWG Heatsink = AAVID Engineering Inc. 5903B, or 5930B. Multiple auxiliary outputs can easily be derived by winding secondaries on the main output inductor to form a transformer. The secondaries must be connected so that the energy is delivered to the auxiliary outputs when the Switch Output turns off. During the OFF time, the voltage across the primary winding is regulated by the feedback loop, yielding a constant Volts/Turn ratio. The number of turns for any given secondary voltage can be calculated by the following equation: # TURNS(SEC) + VO(SEC) ) VF(SEC) VO(PRI))VF(PRI) #TURNS(PRI) Note that the 12 V winding is stacked on top of the 5.0 V output. This reduces the number of secondary turns and improves lead regulation. For best auxiliary regulation, the auxiliary outputs should be less than 33% of the total output power. http://onsemi.com 13 MC34167, MC33167 + Oscillator ILIMIT 4 22 0.01 1N5825 2 L D1 + Reference EA + 1 6.8 k Z1 R1 MUR415 + MTP 3055E 2N3906 R1 36 k VO + 36 V/0.3 A 1000 S Q R Q1 UVLO R VO + 5.05 1 ) 0.7 R2 PWM Thermal 3 Vin -12 V + 5 0.22 0.002 470 k R2 5.1 k 1000 *Gate resistor RG, zener diode D3, and diode D4 are required only when Vin is greater than 20 V. Test Line Regulation Load Regulation Output Ripple Efficiency Conditions Vin = -10 V to - 20 V, IO = 0.3 A Vin = -12 V, IO = 0.03 A to 0.3 A Vin = -12 V, IO = 0.3 A Vin = -12 V, IO = 0.3 A Results 266 mV = 0.38% 7.90 mV = 1.1% 100 mVpp 78.4% L = General Magnetics Technology GMT-0223, 42 turns of #16 AWG on Magnetics Inc. 58350-A2 core. Heatsink = AAVID Engineering Inc. 5903B or 5930B Figure 26. Negative Input/Positive Output Regulator Vin 18 V + Oscillator S Q R PWM Thermal + Reference EA + 1 5.6 k + 47 3 5 0.1 56 k 1.0 k UVLO 2 1N5825 1000 + ILIMIT 4 Brush Motor 50 k Faster Test Low Speed Line Regulation High Speed Line Regulation Conditions Vin = 12 V to 24 V Vin = 12 V to 24 V Results 1760 RPM 1% 3260 RPM 6% Figure 27. Variable Motor Speed Control with EMF Feedback Sensing http://onsemi.com 14 MC34167, MC33167 0.001 T1 MBR20100CT + 1000 1N5404 RFI 115 VAC Filter + 0.001 0.001 220 MJE13005 0.047 1N4937 50 MBR20100CT T2 0.01 0.001 0.001 3.3 + 1N4003 MBR20100CT + 1000 0.001 T1 = Core and Bobbin - Coilcraft PT3595 T1 = Primary - 104 turns #26 AWG T1 = Base Drive - 3 turns #26 AWG T1 = Secondaries - 16 turns #16 AWG T1 = Total Gap - 0.002, T2 = Core - TDK T6 x 1.5 x 3 H5C2 T2 = 14 turns center tapped #30 AWG T2 = Heatsink = AAVID Engineering Inc. T2 = MC34167 and MJE13005 - 5903B T2 = MBR20100CT - 5925B MC34167 Step-Down Converter + 100 + 1000 MC34167 Step-Down Converter + MC34167 Step-Down Converter + Output 1 100k Output 2 Output 3 The MC34167 can be used cost effectively in off-line applications even though it is limited to a maximum input voltage of 40 V. Figure 28 shows a simple and efficient method for converting the AC line voltage down to 24 V. This preconverter has a total power rating of 125 W with a conversion efficiency of 90%. Transformer T1 provides output isolation from the AC line and isolation between each of the secondaries. The circuit self-oscillates at 50 kHz and is controlled by the saturation characteristics of T2. Multiple MC34167 post regulators can be used to provide accurate independently regulated outputs for a distributed power system. Figure 28. Off-Line Preconverter R JA, THERMAL RESISTANCE PD(max) for TA = +50C 70 60 50 40 RqJA 30 0 5.0 10 15 20 L, LENGTH OF COPPER (mm) Free Air Mounted Vertically 3.0 2.0 oz. Copper L 2.5 2.0 1.5 1.0 Minimum Size Pad L 25 30 Figure 29. D2PAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length http://onsemi.com 15 PD, MAXIMUM POWER DISSIPATION (W) 80 JUNCTION-TO-AIR ( C/W) 3.5 IIII IIII IIII IIII MC34167, MC33167 Table 1. Design Equations Calculation ton toff (Notes 1, 2) Step-Down Vout ) VF Vin * Vsat * Vout ton toff ton fosc )1 toff ton fosc Iout DI IL avg ) L 2 Vin * Vsat * Vout ton DIL DIL 1 2 ) (ESR)2 8foscCo R Vref 2 ) 1 R1 Step-Up/Down Vout ) VF1 ) VF2 Vin * VsatQ1 * VsatQ2 ton toff ton fosc )1 toff ton fosc t Iout on ) 1 toff DI IL avg ) L 2 Vin * VsatQ1 * VsatQ2 ton DIL ton )1 toff 1 2 ) (ESR)2 foscCo R Vref 2 ) 1 R1 ton )1 toff Voltage-Inverting |Vout| ) VF Vin * Vsat ton toff ton fosc )1 toff ton fosc t Iout on ) 1 toff DI IL avg ) L 2 Vin * Vsat ton DIL 1 2 ) (ESR)2 foscCo R Vref 2 ) 1 R1 ton Duty Cycle (Note 3) IL avg Ipk(switch) L Vripple(pp) Vout 1. Vsat - Switch Output source saturation voltage, refer to Figure 8. 2. VF - Output rectifier forward voltage drop. Typical value for 1N5822 Schottky barrier rectifier is 0.35 V. 3. Duty cycle is calculated at the minimum operating input voltage and must not exceed the guaranteed minimum DC(max) specification of 0.92. The following converter characteristics must be chosen: Vout - Desired output voltage. Iout - Desired output current. DIL - Desired peak-to-peak inductor ripple current. For maximum output current especially when the duty cycle is greater than 0.5, it is suggested that DIL be chosen minimum current limit threshold of 5.5 A. If the design goal is to use a minimum inductance value, let DIL = 2 (IL avg). This will proportionally reduce the converter's output current capability. Vripple(pp) - Desired peak-to-peak output ripple voltage. For best performance, the ripple voltage should be kept to less than 2% of Vout. Capacitor CO should be a low equivalent series resistance (ESR) electrolytic designed for switching regulator applications. http://onsemi.com 16 MC34167, MC33167 ORDERING INFORMATION Device MC33167D2T MC33167D2TG MC33167D2TR4 MC33167D2TR4G MC33167T MC33167TG MC33167TH MC33167THG MC33167TV MC33167TVG MC34167D2T MC34167D2TG MC34167D2TR4 MC34167D2TR4G MC34167T MC34167TG MC34167TH MC34167THG MC34167TV MC34167TVG TA= 0 to +70C TA= -40 to +85C Operating Temperature Range Package D2PAK (Surface Mount) D2PAK (Surface Mount) (Pb-Free) Shipping 50 Units / Rail 50 Units / Rail 800 / Tape & Reel 800 / Tape & Reel 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 800 / Tape & Reel 800 / Tape & Reel 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail D2PAK (Surface Mount) D2PAK (Surface Mount) (Pb-Free) TO-220 (Straight Lead) TO-220 (Straight Lead) (Pb-Free) TO-220 (Horizontal Mount) TO-220 (Horizontal Mount) (Pb-Free) TO-220 (Vertical Mount) TO-220 (Vertical Mount) (Pb-Free) D2PAK (Surface Mount) D2PAK (Surface Mount) (Pb-Free) D2PAK (Surface Mount) D2PAK (Surface Mount) (Pb-Free) TO-220 (Straight Lead) TO-220 (Straight Lead) (Pb-Free) TO-220 (Horizontal Mount) TO-220 (Horizontal Mount) (Pb-Free) TO-220 (Vertical Mount) TO-220 (Vertical Mount) (Pb-Free) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 17 MC34167, MC33167 PACKAGE DIMENSIONS TO-220 TH SUFFIX CASE 314A-03 ISSUE E -T- B -P- OPTIONAL CHAMFER SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.570 0.585 0.067 BSC 0.015 0.025 0.730 0.745 0.320 0.365 0.140 0.153 0.210 0.260 0.468 0.505 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 14.478 14.859 1.702 BSC 0.381 0.635 18.542 18.923 8.128 9.271 3.556 3.886 5.334 6.604 11.888 12.827 C E Q U A L F K G 5X 5X J D 0.014 (0.356) M S TP M DIM A B C D E F G J K L Q S U TO-220 TV SUFFIX CASE 314B-05 ISSUE L Q B -P- C OPTIONAL CHAMFER E U K F A S L W V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. DIM A B C D E F G H J K L N Q S U V W INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.850 0.935 0.067 BSC 0.166 BSC 0.015 0.025 0.900 1.100 0.320 0.365 0.320 BSC 0.140 0.153 --- 0.620 0.468 0.505 --- 0.735 0.090 0.110 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 21.590 23.749 1.702 BSC 4.216 BSC 0.381 0.635 22.860 27.940 8.128 9.271 8.128 BSC 3.556 3.886 --- 15.748 11.888 12.827 --- 18.669 2.286 2.794 5X J T H N -T- SEATING PLANE G 5X 0.24 (0.610) M D M 0.10 (0.254) TP M http://onsemi.com 18 MC34167, MC33167 PACKAGE DIMENSIONS TO-220 T SUFFIX CASE 314D-04 ISSUE F -T- B -Q- B1 DETAIL A-A SEATING PLANE C E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. DIM A B B1 C D E G H J K L Q U INCHES MIN MAX 0.572 0.613 0.390 0.415 0.375 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.067 BSC 0.087 0.112 0.015 0.025 0.977 1.045 0.320 0.365 0.140 0.153 0.105 0.117 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 9.525 10.541 4.318 4.572 0.635 0.965 1.219 1.397 1.702 BSC 2.210 2.845 0.381 0.635 24.810 26.543 8.128 9.271 3.556 3.886 2.667 2.972 U K 12345 A L G D 5 PL J H M 0.356 (0.014) M TQ B B1 DETAIL A-A http://onsemi.com 19 MC34167, MC33167 D2PAK D2T SUFFIX CASE 936A-02 ISSUE C -T- A K B 12345 OPTIONAL CHAMFER TERMINAL 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN E U V S H M L D 0.010 (0.254) M T N G R P C DIM A B C D E G H K L M N P R S U V SOLDERING FOOTPRINT* 8.38 0.33 1.702 0.067 10.66 0.42 1.016 0.04 3.05 0.12 16.02 0.63 SCALE 3:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 20 MC34167/D |
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